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SKYPERTM 32PRO - Technical Explanations
SKYPERTM 32PRO
Technical Explanations
Revision 02 Status: preliminary
-------------------------------------------------------------------------------------------------------------------------------------------------------------------------This Technical Explanation is valid for the following parts: part number L6100200 Related documents: title Data Sheet SKYPERTM 32PRO Prepared by: Markus Hermwille -------------------------------------------------------------------------------------------------------------------------------------------------------------------------version 03-06-2005 SKYPERTM 32PRO type date code (YYWW) 0520
Content Application and Handling Instructions...................................................................................................................... 2 Further application support ...................................................................................................................................... 2 General Description................................................................................................................................................. 2 Features of SKYPERTM 32PRO............................................................................................................................... 2 Block diagram.......................................................................................................................................................... 3 Dimensions.............................................................................................................................................................. 3 PIN Array - Primary Side......................................................................................................................................... 4 PIN Array - Secondary Side.................................................................................................................................... 5 Driver Performance ................................................................................................................................................. 6 Insulation ................................................................................................................................................................. 6 Auxiliary Power Supply ............................................................................................................................................ 6 Under Voltage Reset (UVR) .................................................................................................................................... 7 Under Voltage Protection (UVP) primary ................................................................................................................. 8 Under Voltage Protection secondary ....................................................................................................................... 8 Input Signals............................................................................................................................................................ 8 Short Pulse Suppression (SPS)............................................................................................................................... 9 Failure Management................................................................................................................................................ 9 Halt Logic Signal (HLS) ........................................................................................................................................... 9 Dead Time generation (Interlock TOP / BOT) adjustable (DT) .............................................................................. 10 Dynamic Short Circuit Protection by VCEsat monitoring / de-saturation monitoring (DSCP).................................... 11 Adjustment of DSCP.............................................................................................................................................. 12 High Voltage Diode for DSCP................................................................................................................................ 12 Gate resistors ........................................................................................................................................................ 13 Soft Turn-Off (STO) ............................................................................................................................................... 13 External Error Input (EEI) ...................................................................................................................................... 14 Application Example .............................................................................................................................................. 14 Mounting Notes ..................................................................................................................................................... 15 Marking.................................................................................................................................................................. 16
Information furnished in this document is believed to be accurate and reliable. However, no representation or warranty is given and no liability is assumed with respect to the accuracy or use of such information. Furthermore, this technical information specifies semiconductor devices but promises no characteristics. No warranty or guarantee expressed or implied is made regarding delivery, performance or suitability. Specifications mentioned in this document are subject to change without notice. This document supersedes and replaces all information previously supplied and may be supersede by updates.
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SKYPERTM 32PRO - Technical Explanations
Please note: All values in this technical explanation are typical values. Typical values are the average values expected in large quantities and are provided for information purposes only. These values can and do vary in different applications. All operating parameters should be validated by user's technical experts for each application.
Application and Handling Instructions Please provide for static discharge protection during handling. As long as the hybrid driver is not completely assembled, the input terminals have to be short-circuited. Persons working with devices have to wear a grounded bracelet. Any synthetic floor coverings must not be statically chargeable. Even during transportation the input terminals have to be short-circuited using, for example, conductive rubber. Worktables have to be grounded. The same safety requirements apply to MOSFET- and IGBT-modules. Any parasitic inductances within the DC-link have to be minimised. Over-voltages may be absorbed by C- or RCD-snubbers between main terminals for PLUS and MINUS of the power module. When first operating a newly developed circuit, SEMIKRON recommends to apply low collector voltage and load current in the beginning and to increase these values gradually, observing the turn-off behaviour of the free-wheeling diode and the turn-off voltage spikes generated across the IGBT. An oscillographic control will be necessary. Additionally, the case temperature of the module has to be monitored. When the circuit works correctly under rated operation conditions, short-circuit testing may be done, starting again with low collector voltage. It is important to feed any errors back to the control circuit and to switch off the device immediately in failure events. Repeated turn-on of the IGBT into a short circuit with a high frequency may destroy the device. The inputs of the hybrid driver are sensitive to over-voltage. Voltages higher than VS +0,3V or below -0,3V may destroy these inputs. Therefore, control signal over-voltages exceeding the above values have to be avoided. The connecting leads between hybrid driver and the power module should be as short as possible (max. 20cm), the driver leads should be twisted.
Further application support Latest information is available at http://www.semikron.com. For design support please read the SEMIKRON Application Manual Power Modules available at http://www.semikron.com.
General Description The SKYPERTM 32PRO core constitutes an interface between IGBT modules and the controller. This core is a half bridge driver. Functions for driving, potential separation and protection are integrated in the driver. Thus it can be used to build up a driver solution for IGBT modules. Features of SKYPERTM 32PRO Two output channels Integrated potential free power supply for secondary side Short Pulse Suppression (SPS) Under Voltage Protection (UVP) primary & secondary Under Voltage Reset (UVR) Drive interlock (dead time) top / bottom (DT) adjustable Dynamic Short Circuit Protection (DSCP) by VCE monitoring and direct switch off Soft Turn-Off (STO) Halt Logic Signal (HLS) Failure Management External Error Input DC bus voltage up to 1200V Coated with varnish
SKYPERTM 32PRO
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SKYPERTM 32PRO - Technical Explanations
Block diagram
Block diagram
Dimensions
Dimensions in mm
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SKYPERTM 32PRO - Technical Explanations
PIN Array - Primary Side
Connectors Connector X10 / X11 (RM2,54, 10pin)
SQ 0,64
2,54
PIN X10:01 X10:02 X10:03
Signal PRIM_nPWRFAIL_IN reserved PRIM_HALT_OUT
Function Under Voltage Reset (supervisor reset to be driven by an external circuitry)
Specification Inverted 15 V logic; 100kOhm impedance; LOW = hold; HIGH = normal operation
Driver core status output
Digital 15 V logic; 100kOhm impedance; LOW = ready to operate; HIGH = not ready to operate Digital 15 V logic; 100kOhm impedance; LOW = enable driver; HIGH = disable driver
X10:04
PRIM_HALT_IN
Driver core status input GND for power supply and GND for digital signals GND for power supply and GND for digital signals Switching signal input (TOP switch)
X10:05 X10:06
PRIM_PWR_GND PRIM_PWR_GND
X10:07
PRIM_TOP_IN
Digital 15 V logic; 100kOhm impedance; LOW = TOP switch off; HIGH = TOP switch on Digital 15 V logic; 100kOhm impedance; LOW = BOT switch off; HIGH = BOT switch on Stabilised +15V 4% Stabilised +15V 4%
X10:08 X10:09 X10:10 X11:01 X11:02 X11:03 X11:04 X11:05 X11:06 X11:07 X11:08 X11:09 X11:10
PRIM_BOT_IN PRIM_PWR_15P PRIM_PWR_15P reserved reserved PRIM_PWR_GND PRIM_PWR_GND PRIM_CFG_TDT2_IN PRIM_CFG_SELECT_IN PRIM_CFG_TDT3_IN PRIM_CFG_TDT1_IN PRIM_PWR_GND PRIM_PWR_GND
Switching signal input (BOTTOM switch) Drive core power supply Drive core power supply
GND for power supply and GND for digital signals GND for power supply and GND for digital signals Digital adjustment of locking time Signal for neutralizing locking function Digital adjustment of locking time Digital adjustment of locking time GND for power supply and GND for digital signals GND for power supply and GND for digital signals Dead time bit #3 Dead time bit #1 Dead time bit #2
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SKYPERTM 32PRO - Technical Explanations
PIN Array - Secondary Side
Connectors Connector X100 / X200 (RM2,54, 10pin)
SQ 0,64
2,54
PIN X100:01 X100:02 X100:03 X100:04 X100:05 X100:06 X100:07 X100:08 X100:09 X100:10 X200:01 X200:02 X200:03 X200:04 X200:05 X200:06 X200:07 X200:08 X200:09 X200:10
1)
Signal SEC_TOP_VCE_CFG SEC_TOP_VCE_IN SEC_TOP_15P SEC_TOP_ERR_IN SEC_TOP_IGBT_ON SEC_TOP_IGBT_OFF SEC_TOP_GND SEC_TOP_GND SEC_TOP_IGBT_SOFTOFF SEC_TOP_8N SEC_BOT_VCE_CFG SEC_ BOT_VCE_IN SEC_ BOT_15P SEC_ BOT_ERR_IN SEC_ BOT_IGBT_ON SEC_ BOT_IGBT_OFF SEC_ BOT_GND SEC_ BOT_GND SEC_BOT_IGBT_SOFTOFF SEC_BOT_8N
Function Input reference voltage adjustment Input VCE monitoring Output power supply External error input Switch on signal TOP IGBT Switch off signal TOP IGBT GND for power supply and GND for digital signals GND for power supply and GND for digital signals Control input for setting soft turn-off TOP IGBT Output power supply Input reference voltage adjustment Input VCE monitoring Output power supply External error input Switch on signal BOT IGBT Switch off signal BOT IGBT GND for power supply and GND for digital signals GND for power supply and GND for digital signals Control input for setting soft turn-off BOT IGBT Output power supply
Specification
Stabilised +15V / max. 10mA 1) Voltage input; 6,6kOhm impedance; LOW = ERROR
Stabilised -7V / max. 10mA 1)
Stabilised +15V / max. 10mA 1) Voltage input; 6,6kOhm impedance; LOW = ERROR
Stabilised -7V / max. 10mA 1)
The average output current of the driver will be reduced accordingly.
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SKYPERTM 32PRO - Technical Explanations
Driver Performance The driver is designed for application with half bridges or single modules and a maximum gate charge per pulse < 6,3C. The charge necessary to switch the IGBT is mainly depending on the IGBT's chip size, the DC-link voltage and the gate voltage. This correlation is shown in module datasheets. It should, however, be considered that the driver is turned on at +15V and turned off at -7V. Therefore, the gate voltage will change by 22V during each switching procedure. Unfortunately, many datasheets do not show negative gate voltages. In order to determine the required charge, the upper leg of the charge curve may be prolonged to +22V for determination of approximate charge per switch. The medium output current of the driver is determined by the switching frequency and the gate charge. The maximum switching frequency may be calculated with the shown equations.
Calculation Switching Frequency Maximum Switching Frequency @ different Gate Charges @ Tamb=25C
60 kHz
fmax =
switching frequency
Iout AV max QGE
50 kHz
40 kHz
30 kHz
fmax: QGE:
Maximum switching frequency Gate charge of the driven IGBT
IoutAVmax: Maximum output average current
20 kHz
10 kHz
0 kHz 0 C
1 C
2 C
3 C 4 C gate charge
5 C
6 C
7 C
Please note: The maximum value of the switching frequency is limited to 50kHz due to switching reasons.
Insulation Magnetic transformers are used for insulation between gate driver primary and secondary side. The transformer set consists of pulse transformers which are used bidirectional for turn-on and turn-off signals of the IGBT and the error feedback between secondary and primary side, and a DC/DC converter. This converter provides a potential separation (galvanic separation) and power supply for the two secondary (TOP and BOT) sides of the driver. Thus, external transformers for power supply are not required.
Creepage and Clearance Distance in mm Primary to secondary Min. 12,2
Auxiliary Power Supply A few basic rules should be followed when dimensioning the customer side power supply for the driver. The following table shows the required features of an appropriate power supply.
Requirements of the auxiliary power supply Regulated power supply Maximum rise time of auxiliary power supply Minimum peak current of auxiliary supply Power on reset completed after +15V 4% 50ms 1A 150ms Please note: Do not apply switching signals during power on reset.
The supplying switched mode power supply may not be turned-off for a short time as consequence of its current limitation. Its output characteristic needs to be considered. Switched mode power supplies with fold-back
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SKYPERTM 32PRO - Technical Explanations
characteristic or hiccup-mode can create problems if no sufficient over current margin is available. The voltage has to rise continuously and without any plateau formation as shown in the following diagram.
Rising slope of the power supply voltage
If the power supply is able to provide a higher current, a peak current will flow in the first instant to charge up the input capacitances on the driver. Its peak current value will be limited by the power supply and the effective impedances (e.g. distribution lines), only. It is recommended to avoid the paralleling of several customer side power supply units. Their different set current limitations may lead to dips in the supply voltage. The driver is ready for operation typically 150ms after turning on the supply voltage. The driver error signal PRIM_HOLD_OUT and PRIM_HOLD_IN are operational after this time. Without any error present, the PRIM_HOLD_OUT signal will be reset. To assure a high level of system safety the TOP and BOT signal inputs should stay in a defined state (OFF state, LOW) during driver turn-on time. Only after the end of the power-on-reset, IGBT switching operation shall be permitted.
Under Voltage Reset (UVR) The Under Voltage Reset circuit configures the driver core to hold in a reset state during power on and power off. UVR can be thought of as a supplement function to the build in power-on-reset by the user. While in reset, the driver is held in its initial condition until PRIM_nPWRFAIL_IN is forced into HIGH state. Once the system reset sequence completes, the driver core is ready to operate.
UVR input Application Hints A capacitor is connected to the input to obtain high noise immunity. Disabling of the Under Voltage Reset (PRIM_nPWRFAIL_IN) can be achieved connection or connection to +15V. function by no
Please note: Do not use PRIM_nPWRFAIL_IN to place the driver core into halt mode during operation.
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SKYPERTM 32PRO - Technical Explanations
Under Voltage Protection (UVP) primary The internally detected supply voltage of the driver has an under voltage protection. The table below gives an overview of the trip level.
Supply voltage Regulated +15V 4% UVP level 13,5V
If the internally detected supply voltage of the driver falls below this level, the IGBTs will be switched off (IGBT driving signals set to LOW). The input side switching signals of the driver will be ignored. The error memory will be set, and the output PRIM_HOLD_OUT changes to the HIGH state. Under Voltage Protection secondary This function monitors the rectified voltage on the secondary side. If the voltage drops, the IGBTs will be switched off (IGBT driving signal set to LOW). The input side switching signals of the driver will be ignored. No failure message will be generated.
Output voltage Regulated +15V UVP level 12V
Input Signals The signal transfer to each IGBT is made with pulse transformers, used for switching on and switching off of the IGBT. The inputs have a Schmitt Trigger characteristic and a positive / active high logic (input HIGH = IGBT on; input LOW = IGBT off). It is mandatory to use circuits which switch active to +15V and 0V. Pull up and open collector output stages must not be used for TOP / BOT control signals. It is recommended choosing the line drivers according to the demanded length of the signal wires.
Please note: It is not permitted to apply switching pulses shorter than 1s.
TOP / BOT Input A capacitor is connected to the input to obtain high noise immunity. This capacitor can cause for current limited line drivers a little delay of few ns, which can be neglected. The capacitors have to be placed as close as possible to the driver interface.
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SKYPERTM 32PRO - Technical Explanations
Short Pulse Suppression (SPS) This circuit suppresses short turn-on and off-pulses of incoming signals. This way the IGBTs are protected against spurious noise as they can occur due to bursts on the signal lines. Pulses shorter than 625ns are suppressed and all pulses longer than 750ns get through for 100% probability. Pulses with a length in-between 625ns and 750ns can be either suppressed or get through.
Pulse pattern - SPS
Failure Management A failure caused by PRIM_nPWRFAIL_IN, under voltage protection, dynamic short circuit detection or external error input will force PRIM_HALT_OUT into HIGH state (not ready to operate). The IGBTs will be switched off (IGBT driving signals set to LOW) and switching pulses from the controller will be not transferred to the output stage. At the same time an internal timer with a time constant of 3s is started. If no failure is present anymore, a time of 3s after failure detection is passed and also TOP and BOT input signals are set to the LOW level for a period of minimum tpERRRESET > 9s, the driver core is ready to operate and switching pulse are transferred to the output stage.
Pulse Pattern Failure Management Propagation delay of the driver, interlock dead time and switching time of the IGBT chip has to be taken into account (not shown in the pulse pattern).
Halt Logic Signal (HLS) The Halt Logic Signals PRIM_HALT_IN and PRIM_HALT_OUT show and control the drive core status. The driver core is placed into halt mode by setting PRIM_HALT_IN into HIGH state (disable driver). This signal can gather disable signals of other hardware components for stopping operation and switching off the IGBT. A HIGH signal will set the driver core into HOLD and switching pulses from the controller will be not transferred to the output stage. The input and output have Schmitt Trigger characteristic. Pull up and open collector output stages must not be used.
Please note: PRIM_HALT_OUT must be always connected with PRIM_HALT_IN. PRIM_HALT_OUT is not short circuit proof.
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SKYPERTM 32PRO - Technical Explanations
Connection PRIM_HALT_OUT and PRIM_HALT_IN Connection PRIM_HALT_OUT (PRIM_HALT_IN not used)
Please note: A HIGH signal @ PRIM_HALT_IN does not generate a HIGH signal @ PRIM_HOLD_OUT. After LOW signal @ PRIM_HALT_IN the gate driver is enable do operate.
Dead Time generation (Interlock TOP / BOT) adjustable (DT) The DT circuit prevents, that TOP and BOT IGBT of one half bridge are switched on at the same time (shoot through). The dead time is not added to a dead time given by the controller. Thus the total dead time is the maximum of "built in dead time" and "controller dead time". It is possible to control the driver with one switching signal and its inverted signal.
Pulse pattern - DT The total propagation delay of the driver is the sum of interlock dead time (tTD) and driver input output signal propagation delay (td(on;off)IO) as shown in the pulse pattern. Moreover the switching time of the IGBT chip has to be taken into account (not shown in the pulse pattern). In case both channel inputs (PRIM_TOP_IN and PRIM_BOT_IN) are at high level, the IGBTs will be turned off. If only one channel is switching, there will be no interlock dead time.
Please note: No error message will be generated when overlap of switching signals occurs.
The dead time can be adjusted and the locking function may be neutralized as shown in the following table.
Adjustment of Dead time / Neutralizing Locking Functions
Interlock time [s] 1 1,3 2 2,3 3 3,3 4* 4,3 no interlock * Factory setting PRIM_CFG_TDT1_IN GND GND GND GND open open open open open PRIM_CFG_TDT2_IN GND GND open open GND GND open open open PRIM_CDG_TDT3_IN open GND open GND open GND open GND open PRIM_CFG_SELECT_IN open open open open open open open open GND
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SKYPERTM 32PRO - Technical Explanations
Please note: The dead time has to be longer than the turn-off delay time of the IGBT in any case. This is to avoid that one IGBT is turned on before the other one is not completely discharged. If the dead time is too short, the heat generated by the short circuit current may destroy the module in the event of a short circuit in top or bottom arm. The average output current is available at each output channel. It is not possible to interconnect the output channels to achieve a higher average output current by neutralizing the locking function.
Dynamic Short Circuit Protection by VCEsat monitoring / de-saturation monitoring (DSCP) The DSCP circuit monitors the collector-emitter voltage VCE of the IGBT during its on-state. VCE is internally limited to 10V. If the reference voltage VCEref is exceeded, the IGBT will be switched off and an error is indicated. The reference voltage VCEref may dynamically be adapted to the IGBTs switching behaviour. Immediately after turn-on of the IGBT, a higher value is effective than in steady state. This value will, however, be reset, when the IGBT is turned off. VCEstat is the steady-state value of VCEref and is adjusted to the required maximum value for each IGBT by an external resistor RCE. It may not exceed 10V. The time constant for the delay of VCEref may be increased by an external capacitor CCE, which is connected in parallel to RCE. It controls the blanking time tbl which passes after turn-on of the IGBT before the VCEsat monitoring is activated. This makes an adaptation to any IGBT switching behaviour possible.
Dynamic saturation voltage characteristic of an IGBT and possible protection level
After tbl has passed, the VCE monitoring will be triggered as soon as VCEsat > VCEref and will turn off the IGBT. The error memory will be set, and the output PRIM_HOLD_OUT changes to the HIGH state. Possible failure modes are shows in the following pictures.
Short circuit during operation Turn on of IGBT too slow * Short circuit during turn on
* or adjusted blanking time too short
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SKYPERTM 32PRO - Technical Explanations
Adjustment of DSCP The external components RCE and CCE are applied for adjusting the steady-state threshold and the short circuit monitoring dynamic as well as the blanking time.
Connection RCE and CCE Dimensioning of RCE and CCE RCE for < 1200V IGBT:
10 x VCEstat + 14 8,6 - VCEstat
R CE (k ) =
RCE for 1700V IGBT :
R CE (k ) =
10 x VCEstat + 18 8,2 - VCEstat
CCE:
C CE (nF ) =
t bl 15 - VCEstat ( V ) 10 x R CE (k ) x ln 10 + R CE (k ) 10 - VCEstat ( V )
Recommended values: 10k < RCE < 100k CCE < 2,7nF 1200V IGBT: RCE=18k, CCE=330pF 1700V IGBT: RCE=36k, CCE=470pF
Application hints If the DSCP function is not used, for example during the experimental phase, SEC_TOP_VCE_IN must be connected with SEC_TOP_GND for disabling SCP @ TOP side and SEC_BOT_VCE_IN must be connected with SEC_BOT_GND for disabling SCP @ BOT side.
High Voltage Diode for DSCP The high voltage diode blocks the high voltage during IGBT off state. The connection of this diode between driver and IGBT is shows in the following schematic.
Connection High Voltage Diode Characteristics Reverse blocking voltage of the diode shall be higher than the used IGBT. Reverse recovery time of the fast diode shall be lower than VCE rising of the used IGBT. Forward voltage of the diode: 1,5V @ 2mA forward current (Tj=25C). A collector series resistance RVCE (1k / 0,4W) must be connected for 1700V IGBT operation.
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SKYPERTM 32PRO - Technical Explanations
Gate resistors The output transistors of the driver are MOSFETs. The sources of the MOSFETs are separately connected to external terminals in order to provide setting of the turn-on and turn-off speed of each IGBT by the external resistors RGon and RGoff. As an IGBT has input capacitance (varying during switching time) which must be charged and discharged, both resistors will dictate what time must be taken to do this. The final value of the resistance is difficult to predict, because it depends on many parameters as DC link voltage, stray inductance of the circuit, switching frequency and type of IGBT.
Connection RGon, RGoff
User Side
RGon
SEC_TOP_IGBT_ON SEC_TOP_IGBT_OFF
Application Hints The gate resistor influences the switching time, switching losses, dv/dt behaviour, etc. and has to be selected very carefully. Due to this influence a general value for the gate resistors cannot be recommended. The gate resistor has to be optimized according to switching behaviour and over voltage peaks within the specific circuitry. By increasing RGon the turn-on speed will decrease. The reverse peak current of the free-wheeling diode will diminish. By increasing RGoff the turn-off speed of the IGBT will decrease. The inductive peak over voltage during turn-off will diminish. In order to ensure locking of the IGBT even when the driver supply voltage is turned off, a resistance (RGE) has to be integrated.
TOP RGE
10K
RGoff
SEC_TOP_GND SEC_TOP_GND
Load
SEC_BOT_IGBT_ON SEC_BOT_IGBT_OFF
RGon RGE
10K
BOT
RGoff
SEC_BOT_GND SEC_BOT_GND
Please note: Do not connect the terminals SEC_TOP_IGBT_ON with SEC_TOP_IGBT_OFF and SEC_BOT_IGBT_ON with SEC_BOT_IGBT_OFF, respectively.
Soft Turn-Off (STO) In case of short circuit, the STO circuit increases the resistance in series with RGoff and turns-off the IGBT at lower speed. This produces smaller voltage spike above the collector emitter of the IGBT by reducing the di/dt value. Because in short-circuit conditions the IGBT's peak current increases and some stray inductance is always present in power circuits, it must fall to zero in a longer time than at normal operation. The soft turn-off time can be adjusted by connection an external resistor RGoff_SC.
Connection RGoff_SC Application Hints The turn-off behaviour and over voltage peaks depends on DC link voltage, stray inductance of the power circuits, type of IGBT, etc. and has to be selected according the specific application. Due to this influence a general value for RGoff_SC cannot be recommended. The resistor has to be selected according to the behaviour of the specific circuitry. The soft turn-off time is limited to 10s. After this time the output stage turn-off with used RGoff.
Please note: The soft turn-off function is no complete protection from induced over voltage in the event of short-circuit turn-off.
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SKYPERTM 32PRO - Technical Explanations
External Error Input (EEI) The external error inputs on the secondary side (high potential) of the gate driver can be used for external fault signals from e. g. an over current protection circuit or over temperature protection circuit to place the gate driver into halt mode. Disabling of this function can be achieved by no connection or connection to +15V (e. g. SEC_TOP_15P, SEC_BOT_15P) to SEC_TOP_ERR_IN and SEC_BOT_ERR_IN. It is possible to use only one error input.
Connection EEI Connection example with using an external transistor in switch mode.
Application Example
Connection Schematic
EXTERNAL ERROR SIGNAL
SKYPER
TM
DC+
32PRO
SEC_TOP_VCE_CFG SEC_TOP_VCE_IN SEC_TOP_15P
BY203/20S 330pF 50V Ron
PRIM_nPWRFAIL_IN
18k
STATUS OUTPUT STATUS INPUT
x1 x2 _ >1 y
SEC_TOP_ERR_IN PRIM_HALT_OUT SEC_TOP_IGBT_ON PRIM_HALT_IN SEC_TOP_IGBT_OFF PRIM_PWR_GND SEC_TOP_GND PRIM_PWR_GND SEC_TOP_GND
Roff
10k
INPUT TOP INPUT BOT
PRIM_TOP_IN SEC_TOP_IGBT_SOFTOFF PRIM_BOT_IN SEC_TOP_8N PRIM_PWR_15P
Roff_sc load
+15V
PRIM_PWR_15P SEC_BOT_VCE_CFG PRIM_PWR_GND SEC_BOT_VCE_IN PRIM_PWR_GND PRIM_CFG_TDT2_IN SEC_BOT_ERR_IN PRIM_CFG_SELECT_IN SEC_BOT_IGBT_ON PRIM_CFG_TDT_3_IN SEC_BOT_15P
BY203/20S 330pF 50V Ron
18k
1nF 100V
1nF 100V
1nF 100V
1nF 100V
1nF 100V
220F 35V
SEC_BOT_IGBT_OFF PRIM_CFG_TDT1_IN SEC_BOT_GND PRIM_PWR_GND SEC_BOT_GND PRIM_PWR_GND SEC_BOT_IGBT_SOFTOFF SEC_BOT_8N
Roff
10k
Roff_sc
DC-
-
application example for 1200V IGBT dead time: 3s UVR disable VCEref = 5V
-
tbl = 1,5s EEI TOP enable (using external transistor in switch mode) EEI BOT disable STO
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SKYPERTM 32PRO - Technical Explanations
Mounting Notes
Soldering Hints The temperature of the solder must not exceed 260C, and solder time must not exceed 10 seconds. The ambient temperature must not exceed the specified maximum storage temperature of the driver. The solder joints should be in accordance to IPC A 610 Revision D (or later) Class 3 (Acceptability of Electronic Assemblies) to ensure an optimal connection between driver core and printed circuit board. Drill Hole & Pad Size in mm
Please note: The driver is not suited for hot air reflow or infrared reflow processes.
The connection between driver core and printed circuit board should be mechanical reinforced by using support posts.
Use of Support Posts Product information of suitable support posts and distributor contact information is available at e.g. http://www.richco-inc.com (e.g. series MSPM).
Please note: The use of agressive materials in cleaning process of driver core may be detrimental for the device parameters.
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SKYPERTM 32PRO - Technical Explanations
Marking Every driver core is marked. The marking contains the following items.
Part Marking Information The Data Matrix Code is described as follows: Type: Standard: Cell size: Dimension: EEC 200 ICO / IEC 16022 0,254 - 0,3 mm 5 x 5 mm
The following data is coded: XXXXXXXXYY 1. SEMIKRON part number (8 digits) + version number (2 digits) 2. Date code (4 digits): YYWW 3. Continuous number referred to date coce (4 digits) 4. Data matrix code 8 digits 2 digits 1 digit 4 digits 1 digit 4 digits ZZZZ VVVV
part number version number blank date code blank continuous number
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